تقنية

iPhone 6s A9 CPU SDRAM Reballing. Fertile methodology.



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iPhone Knowledge Restoration, Microsoldering Repairs, Scholar Coaching

Jessa’s Tools Hyperlinks:

Our thermal digital camera suggestion:
Search Compact Professional for Android
Search Compact Professional for iOS

›Charging:
USB ammeter:
Bona fide MFI charging cables
Anker:
RavPower:

›Microscopy:
Beneficial microscope:
Gentle ring for microscope:
Barlow lens:

›Soldering:
My soldering station with normal iron:
Main soldering tool–mini scorching tweezers
Favourite ideas for mini scorching tweezer:
Favourite tip for traditional iron: BC2

›Ultrasonic cleansing:
Crest iphone sized cleaner:
Branson EC cleansing fluid:

›Sizzling Air:
My scorching air station: JBC TE-1QD not obtainable on Amazon, $1500
Beneficial station:

›Small provides:
My favourite tweezers–
My favourite flux:
My favourite solder:
Kapton tape:
My blue mat:
Chopping board I solder on:
Low soften alloy:
UV mild:

›Diagnostic instruments:
Tristar tester:
DC Energy provide:
Multimeter: Fluke 115
Positive level ideas for multimeter:
Freeze spray:
Zxwtool:

Our thermal digital camera suggestion:
Search Compact Professional for Android
Search Compact Professional for iOS

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مقالات ذات صلة

‫19 تعليقات

  1. You said you prefer the paper towel method. Fair enough. However, it does seem to be wiping away more paste than ideal, in the 3D 'stencil' case especially. I've only ever squeegeed, using regular old stencils. In that case of course, the depth of the holes can easily make up for wiping out more paste. With the 3D thing, I would guess that using a squeegee — preferably thin stainless metal sheet, not plastic — I would expect paste to remain above the pits some, due to surface tension, essentially leaving them already in ballish shapes. Seems that is the intention and it certainly would help all the balls to meet the chip pads properly. Little smears of flux and the odd isolated nanoball should be a problem. Wish I had some here to try. Seems like it should be easier in practice, if they can be made to work well at all. Oh and I wouldn't be pressing down on the cip at all. Just let it float on the solder. /ramble.

  2. i think that the rebal 3d stencil you use is bad because it bends a lot. i had those and i threw them away. i couldnt reball bb cpu on iphone 6. i then switched to cheap round hole stencil and i managed to reball baseband cpus and audio ics with the first try. now i ordered the qianli black stencils and i will try to reball cpu. i hope they are ok.

  3. Could You pour premade balls than gently shake excess and maybe You will get one ball for each indent.
    Then smear the chip with good flux and gently put in on top of the balls.
    Maybe that way You will get bigger balls.

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